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    Power Management presents five technology trends

There are five technology trends in power management

This article source: electronic technology design   https://www.ednchina.com/news/202007271222.html

Five important trends are emerging in the power management industry: high power density, low EMI, low static current, low noise/high precision, and isolation. These five key metrics determine whether a company will continue to be a leader in power management over the next five to 10 years.

Five important trends are emerging in the power management industry:
1. High power density: it can achieve more system functions while reducing system cost.
2. Low EMI: minimize the interference to other system components, so as to simplify the system design and certification process.

3. Low static current (IQ) : extends battery life and storage time, thus realizing more functions, prolongs system service life and reduces system cost.
4. Low noise, high precision: reduce the noise, thus simplifying the power link, improve the reliability of precision simulation applications.
5. Isolation: Higher operating voltages and higher reliability in high-voltage and safety-critical applications.
These five key metrics determine whether a company will continue to be a leader in power management over the next five to 10 years.
At the same time, in terms of ecological environment, the global demand for information exchange and connectivity has been on the rise. Therefore, new power devices, distributed power management, and how products can meet the same or even higher power requirements in smaller applications and smaller end-product sizes have become very urgent and important topics in the industry.
Recently, Texas Instruments (TI) for the above five trends in one breath introduced five innovative power devices. Today, EDN takes a look at how they improve performance over existing devices.

Rising voltage battery charger BQ25790/2: Power density increased by 50%, charging speed increased by 3 times
“Why is power density important for power devices, especially in small packages?” According to Samuel Wong, product line manager for battery management solutions at TI, two things can be seen:
First of all, if you have a high power density, then you can have a higher charging power and charging current, that is, you can fully charge the battery or charge it to about 70% in 30 minutes.
Secondly, the high power density can have more efficient charging efficiency, that is, the charging loss will be smaller, the heat dissipation in the charging process will be smaller, and the temperature increase in the charging process will be less.
BQ25790 and BQ25792 are the new generation of lift voltage charging IC, which can support charging up to 5A, and 1-4 rechargeable batteries. Can adapt to the current USB Type-C, PD standards, and support wireless dual input charging. It boosts the traditional 5 to 10W input ports to 100W, providing more charging power for a variety of applications. In addition, the IC can be operated in step-down and step-up modes, or can be operated in up-down mode as required to meet a wider range of applications.
“The lift IC incorporates a number of external components, including a power MOSFET, a battery FET, a current detection circuit, and a dual input selector. It has a very high power density, 50% higher than similar products, up to 155mW/mm2, its overall application area will be smaller. For example, if the battery is charged at 30W, the chip can achieve 97% efficiency, while the heat is barely felt during the entire charging process. ”
In addition to a good power density design, the device has a low IQ of 1µA, which translates to a power loss of about 0.05% over a year of storage.
In addition to smartphones and tablets, the device can also support more industrial applications, such as medical products. “Now some medical products will also require larger power devices because they have motors inside. “This product enables medical products to be charged faster and at lower temperatures, and does not require a specialized adapter, but can be directly charged using a universal adapter under the USB standard.” “Wong explained.

Stackable DC/DC step-down converter TPS546D24A: Realizes high current FPGA and processor power supply for greater power density

The TPS546D24A is a DC/DC converter designed for high-current FPGas or processors. The highlight of this product is that it can be stacked, and a single product can support 40A current. “When you stack four, you can support up to 160A. The size itself is also very small, in a 5mm x 7mm pin-less QFN package. At the same time, the product switches up to 1.5MHz.” Texas Instruments step-down DC/DC switching regulator product business unit vice president Mark Gary said.
TPS546D24A has the following advantages:
1. Smaller power supply: up to 6 external compensation components can be reduced in the circuit board.
2. Better thermal performance: low thermal resistance of 8.1℃/W, working temperature is 13℃ lower than other DC/DC converters.
3. Improve efficiency at high switching frequencies: Use 0.9mΩ low-edge MOSFET, which is 3.5% more efficient than other DC/DC step-down converters.
4. Meet the strict voltage accuracy requirements: the output voltage error is less than 1%, with pin multiplexing configurable, can help users achieve more accurate current monitoring for fault reporting.
“At ambient temperatures of 85 ° C, the product can stack up to four pieces, providing current support up to 160A. There are a lot of wired networks, 5G base station infrastructure, enterprise-class data centers on the market that are being built in tough environments, but at the same time need to provide very high current and power density. This product can be stacked with four chips, so the current is four times higher than similar power supply IC on the market.” “Gary added.

TPSM53604: Small size 36V, 4A power module will reduce the size of the solution by 30%
TPSM53604 power module product is a 5mm×5.5mm QFN package, the height of this product depends on the integrated inductance in the module. The product supports a single-sided layout with an efficiency of up to 95% and a total area of 85mm2.
Advantages of TPSM53604:
1. Smaller and simpler power supply: The standard QFN package can provide smaller solutions for common 24V and 4A industrial applications.
2. Efficient heat dissipation: It can work at ambient temperature up to 105℃.
3. EMI optimization design: meet CISPR 11 Class B standards.
Highlights of TPSM53604:
In rigorous industrial applications ranging from factory automation design to power grid infrastructure construction, the product can help engineers effectively reduce product design size by 30% and power consumption by 50%. “Such designs provide greater benefits, including the fact that they themselves save product design and development cycles, and allow products to be brought to market more quickly.” “Gary says.

UCC12050/40: Transformer integration technology to isolate the power supply inside the IC
UCC12050/40 adopts transformer integration technology to deliver isolated transmission into a very small IC package, which can provide 500mW efficient isolated DC/DC power supply.
“EMI is an important topic for all power supply designs in the industry. This product enables lower EMI in the industry and is the first to use TI’s new proprietary transformer integration technology.” “Said Gary.
Advantages of UCC12050:
1. Improve power density: Its power and power density is twice that of similar solutions in the market.
2. Low EMI: Integrated transformers have lower primary and secondary capacitance, which can optimize EMI performance.
3. Enhanced isolation, wide temperature range: Enhanced isolation with 8mm creepage distance and electrical gap can provide protection and robustness at different ground potentials.
Highlights of UCC12050:
1. Smaller device sizes can be provided to reduce the size of the end product or application solution.
2. In the industry, transportation, grid architecture, and medical applications are all in high demand for such isolation solutions to provide isolation between 220V input and low-voltage output. This isolation scheme ensures that the product is protected and can function properly at these high and low potential differences.

GaN’s latest planning and progress
First, let’s look at three aspects of TI GaN:
1. GaN enables DC/DC power supplies to achieve faster switching speeds. In the process of switching, there will be power consumption and heat loss. Therefore, if the switch speed is increased, the power consumption and overshoot can be reduced. Currently, GaN can reach speeds of 150V/ns and switch frequencies up to 2MHz or even more than 10MHz.
2. Reliability. TI has more than 30 million hours of internal reliability test data to ensure the lifetime reliability of this product.
3. TI’s planning of GaN’s new elements and concepts. TI’s Gans will be manufactured in its own factories and supply chain, suitable for the ongoing business TI now supports to its customers. In the long run, although the cost of GaN is higher than that of silicon, in the long run GaN has a more developing trend — its cost can be lower than that of silicon, and it also has the advantages of reducing product size and reducing heat and power loss.
Now TI has mass produced 150mΩ, 70mΩ and 50m GaN FET products. In 2018, TI and Siemens also demonstrated the industry’s first 10kW cloud grid link using GaN. TI also recently demonstrated its own convection-cooled, 900V/5000W bi-directional AC/DC platform. This platform will further expand the adoption of GaN in automotive, grid energy storage, solar and other new applications, Gary said. “While the industry has only started to have this topic and demand since around 2015, TI has been developing itself since 2010, so TI has had a very good accumulation over the past decade.”

TI GaN based 900V, 5kW bi-directional converter can achieve up to 99.2% peak efficiency without fan. The solution is scalable, stackable and has a power density about three times higher than conventional IGBT solutions. Such solutions, including the C2000 digital controller products, can help users achieve a complete solution design.